報告時(shí)間：2020年11月25日（周三）14：30 – 16：00
報告地點(diǎn)：機械館J3報告廳
報告形式：遠程視頻
報告人：佐佐木元（Sasaki Gen）
報告人簡(jiǎn)介：
佐佐木元畢業(yè)于日本東北大學(xué)，現在是日本廣島大學(xué)大學(xué)院工學(xué)研究科教授，博士生導師。主要的研究方向：有關(guān)高功能?高性能金屬、陶瓷及金屬基復合材料的物理現象的闡明和開(kāi)發(fā)的研究。專(zhuān)業(yè)領(lǐng)域包括機械材料（金屬基復合材料、陶瓷基復合材料、鋁/鎂等輕金屬材料)、電子顯微鏡和X射線(xiàn)衍射的表征。目前研究的方向為高功能?高性能金屬、陶瓷及金屬基復合材料的物理現象的闡明和開(kāi)發(fā)。基于納米?亞微米尺寸級別下組織觀(guān)察，組織定量化以及利用計算機模擬的建模來(lái)指導加工工藝，從而實(shí)現對材料組織的調控。最新的研究方向為賦予方向性的高熱傳導金屬基復合材料的開(kāi)發(fā)和熱傳導特性的理論評價(jià)。在Materials Science and Engineering A, Journal of Materials Processing Technology, Journal of Alloys and Compounds等國際期刊，日本金屬學(xué)會(huì )志，粉體和粉末冶金，輕金屬等日本國內期刊，以及國際會(huì )議上發(fā)表論文123篇。曾任日本粉體粉末冶金協(xié)會(huì )參事，日本鑄造工程學(xué)會(huì )編輯委員會(huì )同行評審會(huì )員；現任日本復合材料學(xué)會(huì )理事，輕金屬獎學(xué)會(huì )選考委員會(huì )選考委員，日本機械學(xué)會(huì )機械材料?生產(chǎn)加工部擴大指導委員會(huì )委員，廣島市產(chǎn)業(yè)技術(shù)支援顧問(wèn)。并獲得2016年日本機械工程師學(xué)會(huì )機械材料和材料加工分會(huì )性能獎。
報告內容簡(jiǎn)介：
Withthe rapid development ofintegration and miniaturization in electronic devices and circuitry, heat dissipation has emerged as a severe issue in recent years.It is well knownpoor heat dissipation will significantly despair the performance of electronic devices because of heat accumulation induced high temperature. Therefore, how to enhance the heat dissipation has become a hot research topic. All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. There are several techniques for releasing heat including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others, among which heat sinks are the most effective way to transfer heat. Heat conduction efficiency of heat sinks highly depends on the interfacial thermal resistance and intrinsic thermal conductivity of heat sink materials. Accordingly, we are focusing on developing different novel metal matrix composites (MMCs) with high performance as heat sink materials, since the microstructure of MMCs can be tailored in order to achieve high thermal conductivity as well as high performance. In this report, we will introduce some novel MMCs synthesized in our laboratory from the viewpoint of interfacial design, fraction and size tailoring of reinforcement, and computational simulation to further understand the mechanism of thermal enhancement of MMCs for the application of heat sink materials.
*本報告由燕山大學(xué)引才引智國際合作培育項目資助。
機械工程學(xué)院
2020年11月18日
